ABChimie 526UV DS55 M

PRODUCT DESCRIPTION

ABchimie526UV DS55 M varnish is a transparent, one-component varnish, designed
for the protection of printed circuit boards subjected to harsh environments. It benefits
dual cure technology (UV/humidity) allowing cross-linking in shaded areas.
ABchimie526UV DS55 M varnish can be applied by dipping, brush,
Pad printing, vaporization, and of course selective deposition machines, which are the means of
Ideal application. The low viscosity of our system allows for minimal thickness on the card.
approximately 80 microns.
ABchimie526UV DS55 M varnish complies with REACH regulations and
RoHS. A certificate can be drawn up upon request at: info@abchimie.com.

FEATURES

• Excellent grip in severe conditions,
• Fluorescent under ultraviolet climatic rays to allow for monitoring of the varnish layer
filed,
• Temperature range from -55°C to +150°C,
• Heat-sealable varnish,
• Mold resistance,
• Excellent dielectric properties,
• Ultra-fast polymerization under UV exposure,
• Polymerization of shaded areas with moisture,
• 0 VOC,
• Reduced floor space required compared to solvent-based solutions
• Faster processes, increased productivity,
• Use in selective deposition machines (compatible with SC200, SC280, SC300 and
SC400),
• UL94-V0 (QMJU2- E308681),
• IEC NF EN 61086,
• NF EN 16101, NF EN 16102 approval.